Intel (NASDAQ: INTC) is enduring a painful year. Because of worsening economic conditions, the semiconductor manufacturer's revenue tumbled 20% in the third quarter, while its earnings plummeted even further. That's putting pressure on its financial profile as the company strives to fund its ambitious expansion program while maintaining its high-yielding dividend.

This painful situation led Intel to seek outside-the-box ways to finance its growth to maintain its balance sheet strength and investor payout. It did that by unveiling a first-of-its-kind semiconductor co-investment program, with Brookfield Infrastructure (NYSE: BIPC)(NYSE: BIP) signing on as the first participant. Intel's pain looks to be Brookfield's gain.

Intel has an ambitious expansion plan to grow its chip-making capacity in the U.S. It's investing upwards of $30 billion to build two leading-edge chip factories in Arizona. It also plans to spend more than $20 billion to build two more factories in Ohio. On top of that, Intel is investing heavily in several other capital projects worldwide. 

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Source Fool.com